Pulugurtha, Markondeyaraj
- Associate Professor, Biomedical Engineering , College of Engineering and Computing

Overview
overview
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Dr. P. M. Raj is an Associate Professor with ECE. His expertise is in the areas of packaging of electronic and bioelectronic systems, power-supply component integration, RF/5G components, integrated RF and power modules and fine-pitch interconnections. He is an adjunct faculty with the Georgia Institute of Technology, ECE Department and Packaging Research Center, where he co-lead several technical thrusts in electronic packaging, working with the whole electronic ecosystem, which includes semiconductor, packaging, material, tool and end-user companies. He is widely recognized for his contributions in integrated passive components and technology roadmaping, and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications, as evident through his several industry partnerships, invited presentations, publications and awards.
His research led to ~290 publications, which include ~80 journal papers, 14 book chapters and 12 articles in widely circulated trade magazines, and more than 175 conference publications. He received 8 patents with several other provisional patents and invention disclosures. His papers received more than 20 best-paper awards. He has been a research faculty at GT-PRC for 19 years, where he mentored more than 25 MS and PhD students.
He is the Associate Editor for IEEE CPMT transactions and IEEE Nanotechnology magazine. He is the Co-Chair for the IEEE nanopackaging technical committee. He has been instrumental in forming the “Nanopackaging” technical sessions at the IEEE NANOTECHNOLOGY conference. He chaired power and RF component and module sessions at the IEEE Electronic Component and Technology Conference (ECTC). He also co-chaired high-temperature packaging sessions at the IEEE/SEMI/iNEMI Future Car Electronics workshop. He has been actively involved with the PSMA (power sources manufacturers Association) and takes pro-active role in shaping up power electronics sessions at APEC and PEIM conferences. He is also in the steering committee of IEEE EPS IoT Committee. He was reviewer for about 100 journal papers. Dr. Raj is also a STEM ambassador and frequently offers nanoscience and nanotechnology demonstrations at local schools and at Georgia Tech for K-12 field trips.
research interests
- 5G mobile communication,MIMO communication,array signal processing,impedance matching,integrated circuit interconnections,laser beam machining,microwave antenna arrays,minimisation,next generation networks,system-in-package,vias
Scholarly & Creative Works
selected publications
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Article
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2021Modeling and validation of ESR and frequency-stability of high-density nanostructured capacitors for embedded power convertersFull Text via DOI: 10.1016/j.mee.2021.111593 Web of Science: 000683574400005
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2020Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 68:5082-5092.Full Text via DOI: 10.1109/TMTT.2020.3022357 Web of Science: 000597191000012
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2020Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS. 19:1963-1967.Full Text via DOI: 10.1109/LAWP.2020.3018064 Web of Science: 000594631200027
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2020Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration. JOURNAL OF ELECTRONIC MATERIALS.Full Text via DOI: 10.1007/s11664-020-08399-x Web of Science: 000568203900001
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2020Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 10:1515-1523.Full Text via DOI: 10.1109/TCPMT.2020.3013725 Web of Science: 000572626600013
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2020Reliability of Fine-Pitch <5-mu m-Diameter Microvias for High-Density Interconnects. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 10:1552-1559.Full Text via DOI: 10.1109/TCPMT.2020.3013197 Web of Science: 000572626600017
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2020Low-Loss Impedance-Matched Sub-25-mu m Vias in 3-D Millimeter-Wave Packages. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 10:870-877.Full Text via DOI: 10.1109/TCPMT.2020.2982294 Web of Science: 000536298700014
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2020Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 10:531-533.Full Text via DOI: 10.1109/TCPMT.2020.2968305 Web of Science: 000520493900020
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2020Substrate-Embedded Low-Resistance Solenoid Inductors for Integrated Voltage Regulators. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 10:134-141.Full Text via DOI: 10.1109/TCPMT.2019.2956528 Web of Science: 000508385200016
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20193-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 9:1466-1472.Full Text via DOI: 10.1109/TCPMT.2019.2923698 Web of Science: 000484294000003
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2018First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS. 28.Full Text via DOI: 10.1109/LMWC.2018.2876769 Web of Science: 000452439000016
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2018Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics. IEEE NANOTECHNOLOGY MAGAZINE. 12.Full Text via DOI: 10.1109/MNANO.2018.2869235 Web of Science: 000450604000003
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2018Ultra-High Density, Thin-Film Tantalum Capacitors with Improved Frequency Characteristics for MHz Switching Power Converters. JOURNAL OF ELECTRONIC MATERIALS. 47:5632-5639.Full Text via DOI: 10.1007/s11664-018-6466-4 Web of Science: 000440111200094
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2018Ultrathin High-Q 2-D and 3-D RF Inductors in Glass PackagesFull Text via DOI: 10.1109/TCPMT.2018.2807416
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2017RF inductors with sputtered nanomagnetic films on glass substratesFull Text via DOI: 10.1007/s10854-017-7396-2
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2017Machine-Learning Approach for Design of Nanomagnetic-Based AntennasFull Text via DOI: 10.1007/s11664-017-5487-8
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2017Reliability of copper through-package vias in bare glass interposersFull Text via DOI: 10.1109/TCPMT.2017.2691407
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2016Structure-magnetic property correlations in nickel-polymer nanocompositesFull Text via DOI: 10.1007/s10854-015-3731-7
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2014Cobalt-polymer nanocomposite dielectrics for miniaturized antennasFull Text via DOI: 10.1007/s11664-014-3025-5
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2013Magnetic losses in metal nanoparticle-insulator nanocompositesFull Text via DOI: 10.1007/s10854-013-1269-0
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2013Multichip embedding technology using fine-pitch Cu-Cu interconnectionsFull Text via DOI: 10.1109/TCPMT.2012.2235528
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2012Nanomagnetics for High-Performance, Miniaturized Power, and RF ComponentsFull Text via DOI: 10.1109/MNANO.2012.2203878
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2011Leakage current analysis of hydrothermal BaTiO
3 thin filmsFull Text via DOI: 10.1007/s10832-011-9662-7 -
2009Nanopackaging Research at Georgia Tech: 3-D system miniaturizationFull Text via DOI: 10.1109/MNANO.2009.934864
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2007Lead-free solder films via novel solution synthesis routesFull Text via DOI: 10.1109/TCAPT.2007.900062
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2004Evaluation of alternative materials for system-on-package (SOP) substratesFull Text via DOI: 10.1109/TCAPT.2004.838906
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2004Process development for PWB compatible embedded capacitorsFull Text via DOI: 10.1108/03056120410496360
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2003Colloidal processing of polymer ceramic nanocomposite integral capacitorsFull Text via DOI: 10.1109/TEPM.2003.817719
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19992-D particle shape averaging and comparison using Fourier descriptorsFull Text via DOI: 10.1016/S0032-5910(99)00046-7
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1998Measurement of particle orientation in tape cast ceramic microstructuresFull Text via DOI: 10.1023/A:1023377513827
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1995The CaO-SrO-CuO-O
2 system: Phase equilibria and thermodynamic properties at 1123 KFull Text via DOI: 10.1007/BF02664848
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Book Chapter
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2021High‐Density Electronic Integration for Wearable Sensing. 435-467.Full Text via DOI: 10.1002/9781119683285.ch12
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2018Inductors: Micro-to nanoscale embedded thin power inductors. 311-343.Full Text via DOI: 10.1007/978-3-319-90362-0_10
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2017Package-Compatible High-Density Nano-Scale Capacitors with Conformal Nano-Dielectrics. 79-91.Full Text via DOI: 10.1201/b15035-7
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2017Package-compatible high-density nano-scale capacitors with conformal nano-dielectrics. 79-92.Full Text via DOI: 10.1201/b15035
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2015Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components. 175-189.Full Text via DOI: 10.1007/978-3-319-21194-7_11
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Conference
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2022Bioelectronic System Scaling Solutions with Nanopackaging. 1-1.Full Text via DOI: 10.1109/nmdc50713.2021.9677503
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2021Tunable Multiferroics for Reconfigurable RF System PackagesFull Text via DOI: 10.1109/NMDC50713.2021.9677517 Web of Science: 000782306900031
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2021Low-Impedance Graphene - PEDOT-PSS Electrodes for Neural Recording and Stimulation in Implantable Medical Devices. 327-330.Full Text via DOI: 10.1109/NANO51122.2021.9514286 Web of Science: 000702270900059
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2021Chipscale Piezo-Magnetostrictive Interfaces - A new simplified and microminiaturized telemetry paradigm for Medical Device Packages. 1219-1225.Full Text via DOI: 10.1109/ECTC32696.2021.00199 Web of Science: 000702282700187
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2021Wireless Photonic Sensors with Flex Fan-Out Packaged Devices and Enhanced Power Telemetry. 1550-1556.Full Text via DOI: 10.1109/ECTC32696.2021.00246 Web of Science: 000702282700234
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2020Flexible Ink-Based Interconnects for Textile-Integrated RF Components. 151-152.Full Text via DOI: 10.1109/IEEECONF35879.2020.9330329 Web of Science: 000657357700076
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2020High-Density Component Integration in Fabrics with Thin Flex Interposers. 1573-1574.Full Text via DOI: 10.1109/IEEECONF35879.2020.9329464 Web of Science: 000657357701349
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2019Ultra-Wideband, Glass Package-Integrated Power Dividers for 5G and mm-Wave Applications. 863-864.Web of Science: 000657207103014
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20193D Packaging with Embedded High-Power-Density Passives for Integrated Voltage Regulators. 1300-1305.Full Text via DOI: 10.1109/ectc.2019.00201
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2019Nanostructures for enabling implantable bioelectronic systemsFull Text via DOI: 10.1109/NMDC.2018.8605818
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2018Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module. 107-109.Full Text via DOI: 10.1109/EPEPS.2018.8534215
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2018High-Temperature and Moisture-Ageing Reliability of High-Density Power Packages for Electric Vehicles. 179-184.Full Text via DOI: 10.1109/ECTC.2018.00035
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2018Integrated copper heat spreaders in glass panel embedded packages with near-zero thermal interface resistance. 2013-2018.Full Text via DOI: 10.1109/ECTC.2018.00302
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2018Leading-edge and ultra-thin 3D glass-polymer 5G modules with seamless antenna-to-transceiver signal transmissions. 2026-2031.Full Text via DOI: 10.1109/ECTC.2018.00304
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2018Miniaturized High-Performance Filters for 5G Small-Cell Applications. 1068-1075.Full Text via DOI: 10.1109/ECTC.2018.00164
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2018Design and demonstration of ultra-Thin 3D glass-based 5G modules with low-loss interconnects. 180-183.Full Text via DOI: 10.23919/ICEP.2018.8374698
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2017Design and analysis of receiver channels of glass interposer for dual band Wi-Fi front end module (FEM). 597-601.Full Text via DOI: 10.1109/ISEMC.2017.8077938
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20173D printed wearable flexible SIW and microfluidics sensors for Internet of Things and smart health applications. 544-547.Full Text via DOI: 10.1109/MWSYM.2017.8058621
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2017Analysis of System-Level Reliability of Single-Chip Glass BGA Packages with Advanced Solders and Polymer Collars. 1405-1412.Full Text via DOI: 10.1109/ECTC.2017.319
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2017Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters. 2256-2262.Full Text via DOI: 10.1109/ECTC.2017.312
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2017First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules. 236-241.Full Text via DOI: 10.1109/ECTC.2017.329
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2017High-Voltage Capacitors for Next-Generation Power Modules in Electric Vehicles. 1695-1700.Full Text via DOI: 10.1109/ECTC.2017.95
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2017Interfacial Delamanination of Mold Compound in Fan-Out Packages. 827-833.Full Text via DOI: 10.1109/ECTC.2017.323
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2017Scaling Cu Pillars to 20um Pitch and Below: Critical Role of Surface Finish and Barrier Layers. 384-391.Full Text via DOI: 10.1109/ECTC.2017.324
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2017Electrodeposited copper-graphite composites for low-CTE-Integrated thermal structures. 56-62.Full Text via DOI: 10.4071/imaps.435561
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2016Board-Level Reliability of 3D through Glass via Filters during Thermal Cycling. 1575-1582.Full Text via DOI: 10.1109/ECTC.2016.362
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2016Demonstration of Next-Generation Au-Pd Surface Finish with Solder-Capped Cu Pillars for Ultra-Fine Pitch Applications. 2553-2560.Full Text via DOI: 10.1109/ECTC.2016.331
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2016Design and Demonstration of Ultra-Thin Glass 3D IPD Diplexers. 2348-2352.Full Text via DOI: 10.1109/ECTC.2016.265
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2016Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules. 1958-1963.Full Text via DOI: 10.1109/ECTC.2016.270
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2016Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites. 206-210.Full Text via DOI: 10.1109/ECTC.2016.294
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2016Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages. 2384-2388.Full Text via DOI: 10.1109/ECTC.2016.287
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2016Modeling Design Fabrication and Demonstration of RF Front-End Module with Ultra-Thin Glass Substrate for LTE Applications. 1297-1302.Full Text via DOI: 10.1109/ECTC.2016.310
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2016Ultra-Thin Wireless Power Module with Integration of Wireless Inductive Link and Supercapacitors. 2364-2371.Full Text via DOI: 10.1109/ECTC.2016.318
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2016Enabling antenna design with nano-magnetic materials using machine learningFull Text via DOI: 10.1109/NMDC.2015.7439256
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2015A V-band end-fire Yagi-Uda antenna on an ultra-Thin glass packaging technology. 618-621.Full Text via DOI: 10.1109/EuMC.2015.7345839
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2015Interconnection materials, processes and tools for fine-pitch panel assembly of ultra-thin glass substrates. 475-483.Full Text via DOI: 10.1109/ECTC.2015.7159634
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2015Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages. 1956-1960.Full Text via DOI: 10.1109/ECTC.2015.7159869
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2015Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation. 1163-1167.Full Text via DOI: 10.1109/ECTC.2015.7159742
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2015Nanomagnetic structures for inductive coupling and shielding in wireless charging applications. 941-945.Full Text via DOI: 10.1109/ECTC.2015.7159707
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2015Synthesis of magneto-dielectrics from first principles and antenna design. 2228-2234.Full Text via DOI: 10.1109/ECTC.2015.7159913
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2015Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors. 230-235.Full Text via DOI: 10.1109/ECTC.2015.7159597
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2015Nanomagnetic films and arrays for nonlinear devices in highly-integrated RF modules. 588-591.Full Text via DOI: 10.1109/NANO.2015.7388672
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2014Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics. 27-31.Full Text via DOI: 10.1109/NANO.2014.6968011
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2014A new era in manufacturable, low-temperature and ultra-fine pitch Cu interconnections and assembly without solders. 484-489.Full Text via DOI: 10.1109/ECTC.2014.6897328
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2014Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections. 1160-1165.Full Text via DOI: 10.1109/ECTC.2014.6897436
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2014Adhesion and reliability of direct Cu metallization of through-package vias in glass interposers. 2266-2270.Full Text via DOI: 10.1109/ECTC.2014.6897620
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2014Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers. 541-547.Full Text via DOI: 10.1109/ECTC.2014.6897337
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2014Large low-CTE glass package-to-PCB interconnections with solder strain-relief using polymer collars. 1959-1964.Full Text via DOI: 10.1109/ECTC.2014.6897571
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2014Magneto-dielectric characterization and antenna design. 782-788.Full Text via DOI: 10.1109/ECTC.2014.6897374
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2014Nanowires-based high-density capacitors and thinfilm power sources in ultrathin 3D glass modules. 1492-1497.Full Text via DOI: 10.1109/ECTC.2014.6897491
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2014Magneto-dielectric material characterization and antenna design for RF applications. 381-384.Full Text via DOI: 10.1109/EuCAP.2014.6901771
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2013Inkjet-printed ferromagnetic nanoparticles for miniaturization of flexible printed RF inductors. 994-995.Full Text via DOI: 10.1109/APS.2013.6711157
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20133D IPAC - A new passives and actives concept for ultra-miniaturized electronic and bioelectronic functional modules. 517-522.Full Text via DOI: 10.1109/ECTC.2013.6575621
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2013A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module. 1197-1203.Full Text via DOI: 10.1109/ECTC.2013.6575727
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2013Low cost, high performance, and high reliability 2.5D silicon interposer. 342-347.Full Text via DOI: 10.1109/ECTC.2013.6575593
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2013Ultra-thin and ultra-high I/O density package-on-package (3D Thin PoP) for high bandwidth of smart systems. 406-411.Full Text via DOI: 10.1109/ECTC.2013.6575603
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2013Ultra-thin, self-healing decoupling capacitors on thin glass interposers using high surface area electrodes. 1043-1047.Full Text via DOI: 10.1109/ECTC.2013.6575701
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2012
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2012A low-cost approach to high-k thinfilm decoupling capacitors on silicon and glass interposers. 1356-1360.Full Text via DOI: 10.1109/ECTC.2012.6249011
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2012High current-carrying and highly-reliable 30μm diameter Cu-Cu area-array interconnections without solder. 577-582.Full Text via DOI: 10.1109/ECTC.2012.6248888
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2012High-density capacitors with conformal high-k dielectrics on etched-metal foils. 1640-1643.Full Text via DOI: 10.1109/ECTC.2012.6249057
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2011Thin film power components with nanoscale electrodes and conformal dielectrics. 106-110.Full Text via DOI: 10.1109/NANO.2011.6144648
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2011Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections. 916-920.Full Text via DOI: 10.1109/ECTC.2011.5898621
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2011High throughput and fine pitch Cu-Cu interconnection technology for multichip chip-last embedding. 2021-2027.Full Text via DOI: 10.1109/ECTC.2011.5898794
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2011Novel nanomagnetic materials for high-frequency RF applications. 1244-1249.Full Text via DOI: 10.1109/ECTC.2011.5898670
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2010Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials. 1708-1712.Full Text via DOI: 10.1109/ECTC.2010.5490744
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2009Antenna miniaturization using magneto-dielectric substrates. 801-808.Full Text via DOI: 10.1109/ECTC.2009.5074103
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2009Highly-reliable, 30μm pitch copper interconnects using nano-ACF/NCF. 1479-1485.Full Text via DOI: 10.1109/ECTC.2009.5074208
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2009Evolution of sintering anisotropy using a 2d finite difference method. 1391-1395.Full Text via DOI: 10.1111/j.1551-2916.2009.03013.x
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2008Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer. 1410-1416.Full Text via DOI: 10.1109/ECTC.2008.4550162
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2008Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect. 1242-1248.Full Text via DOI: 10.1109/ECTC.2008.4550134
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2008Real-time protein detection using ZnO nanowire/thin film bio-sensor integrated with microfluidic system. 1317-1322.Full Text via DOI: 10.1109/ECTC.2008.4550146
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2007Integrating high-k ceramic thin film capacitors into organic substrates via low-cost solution processing. 585-594.Full Text via DOI: 10.1109/TCAPT.2007.901737
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2007Electrochemical biosensors and microfluidics in organic system-on-package technology. 1550-1555.Full Text via DOI: 10.1109/ECTC.2007.374001
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2007Label-free protein detection by ZnO nanowire based bio-sensors. 1971-1976.Full Text via DOI: 10.1109/ECTC.2007.374071
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2007Organic-based RF capacitors with ceramic-like properties. 1866-1869.Full Text via DOI: 10.1109/ECTC.2007.374052
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2007Processing, properties and electrical reliability of embedded ultra-thin film ceramic capacitors in organic packages. 1014-1018.Full Text via DOI: 10.1109/ECTC.2007.373921
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2007Reliability of nano-structured nickel interconnections replacing FlipChip solder assembly without underfill. 905-913.Full Text via DOI: 10.1109/ECTC.2007.373906
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2007Conductimetric detection of protein and cancer cells with oxide nanosensors. 126-131.Full Text via DOI: 10.1557/proc-1010-v06-09
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2006Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration. 1375-1380.Full Text via DOI: 10.1109/ECTC.2006.1645836
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2005Magnetic nanocomposites for organic compatible miniaturized antennas and inductors. 272-275.Full Text via DOI: 10.1109/ISAPM.2005.1432088
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2005Mid frequency decoupling using embedded decoupling capacitors. 271-274.Full Text via DOI: 10.1109/EPEP.2005.1563756
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2005
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2005Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs. 108-112.Full Text via DOI: 10.1109/ICEPT.2005.1564691
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2004BaTiO
3 films by low-temperature hydrothermal techniques for next generation packaging applications. 95-100.Full Text via DOI: 10.1007/s10832-004-5082-2 -
2003
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2003New package/board materials technology for next-generation convergent microsystems. 331-335.Full Text via DOI: 10.1109/EPTC.2003.1271540
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2003Sol-gel derived and repairable nano-interconnects. 385-389.Full Text via DOI: 10.1109/EPTC.2003.1271551
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2002Novel hydrothermal processing (<100 °C) of ceramic-polymer composites for integral capacitor applications. 1699-1703.Full Text via DOI: 10.1109/ECTC.2002.1008337
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2002Design and fabrication of high aspect ratio fine pitch interconnects for wafer level packaging. 229-234.Full Text via DOI: 10.1109/EPTC.2002.1185673
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2002Low temperature (<100°C) hydrothermal synthesis of high K-low loss BaTiO
3 films for integral capacitors. 79-84.Full Text via DOI: 10.1109/EPTC.2002.1185602 -
2002Reliability assessment of high density multi-layer board assembly using shadow Moiré and luminescence spectroscopy. 126-132.Full Text via DOI: 10.1109/EPTC.2002.1185610
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2002The role of stiff base substrates in warpage reduction for future high-density-wiring requirements. 221-225.Full Text via DOI: 10.1109/ISAPM.2002.990390
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Editorial Material
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2019Nanopackaging Pervades Future Electronic and Bioelectronic Systems [Guest Editorial]. 4-6.Full Text via DOI: 10.1109/MNANO.2018.2881346
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2018Next-generation nanopackaging [Guest editorial]. 4-5.Full Text via DOI: 10.1109/MNANO.2018.2869521
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2016Foreword special section on nanopackaging. 1731-1732.Full Text via DOI: 10.1109/TCPMT.2016.2635499
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Letter
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2021Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules. 708-711.Full Text via DOI: 10.1109/TCPMT.2021.3068986 Web of Science: 000642765400019
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Note
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Preprint
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Proceedings Paper
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20203D Heterogeneous and Flexible Package Integration for Zero-Power Wireless Neural Recording. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020). 1003-1009.Full Text via DOI: 10.1109/ECTC32862.2020.00163 Web of Science: 000620983200151
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2020Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020). 89-94.Full Text via DOI: 10.1109/ECTC32862.2020.00027 Web of Science: 000620983200015
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2020Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020). 1376-1382.Full Text via DOI: 10.1109/ECTC32862.2020.00218 Web of Science: 000620983200206
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2020High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020). 835-840.Full Text via DOI: 10.1109/ECTC32862.2020.00136 Web of Science: 000620983200125
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2020Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020). 671-676.Full Text via DOI: 10.1109/ECTC32862.2020.00111 Web of Science: 000620983200100
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20193D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas. 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC). 960-967.Full Text via DOI: 10.1109/ECTC.2019.00150 Web of Science: 000503261500143
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2019Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages. 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC). 718-725.Full Text via DOI: 10.1109/ECTC.2019.00114 Web of Science: 000503261500107
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2019Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications. 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC). 972-976.Full Text via DOI: 10.1109/ECTC.2019.00152 Web of Science: 000503261500145
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2018Nanostructures for Enabling Implantable Bioelectronic Systems. 2018 IEEE 13TH NANOTECHNOLOGY MATERIALS AND DEVICES CONFERENCE (NMDC). 108-112.Web of Science: 000467808200028
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Review
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2022Packaging Materials in High-Performance Computing ApplicationsFull Text via DOI: 10.1007/s41745-021-00282-w
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2021A Review of 5G Front-End Systems Package Integration. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 118-133.Full Text via DOI: 10.1109/TCPMT.2020.3041412 Web of Science: 000613373500014
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2017System Scaling with Nanostructured Power and RF Components. 2330-2346.Full Text via DOI: 10.1109/JPROC.2017.2748520
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2005
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Research
principal investigator on
- Additive Manufacturing of Heterogeneous-Integrated Systems With Chiplet-First Embedding for Wireless Sensors awarded by Nano Dimensions 2021 - 2023
- I-Corps Team: Power SLICE (Single-Layer Integration with Component Embedding) for Emerging Wearable and IoT Electronics awarded by National Science Foundation 2021 - 2022
- Advanced power components and integration awarded by Novelis Inc. 2019 - 2021
- Integrated Nanoscale EMI Shielding and Thermal Structures awarded by Georgia Institute of Technology 2018 - 2019
- Advanced Components and Integration for Systems Packaging awarded by Georgia Tech Research Corp. 2018 - 2019
co-principal investigator on
Contact
full name
- Markondeyaraj Pulugurtha
Identifiers
ORCID iD
- https://orcid.org/0000-0002-9298-7513 (confirmed)
visualizations
Recent publications and grants in Scholars@FIU
publication subject areas
Citation index-derived subject areas the researcher has published in