A liquid cooler module with carbon foam for electronics cooling applications Article

Cao, Yiding, Ponnappan, Rengasamy. (2008). A liquid cooler module with carbon foam for electronics cooling applications . JOURNAL OF ENHANCED HEAT TRANSFER, 15(4), 313-324. 10.1615/JEnhHeatTransf.v15.i4.40



cited authors

  • Cao, Yiding; Ponnappan, Rengasamy

fiu authors

publication date

  • 2008

published in

Digital Object Identifier (DOI)

start page

  • 313

end page

  • 324

volume

  • 15

issue

  • 4

research area