3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon Article

Industry Collaboration International Collaboration

cited authors

  • Spurney, Robert Grant; Sharma, Himani; Raj, Pulugurtha Markondeya; Tummala, Rao; Lollis, Naomi; Weaver, Mitch; Romig, Matt; Gandhi, Saumya; Brumm, Holger

publication date

  • August 1, 2019

webpage

author keyword

category

Digital Object Identifier (DOI)

start page

  • 1466

end page

  • 1472

volume

  • 9

issue

  • 8