Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations Proceedings Paper

cited authors

  • Soleimanikutanaei, Soheil; Lin, Cheng-Xian; Pala, Nezih; Quan, Gang; IEEE

publication date

  • January 1, 2019

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author keyword

category

start page

  • 1260

end page

  • 1265