Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations Proceedings Paper

Soleimanikutanaei, Soheil, Lin, Cheng-Xian, Pala, Nezih et al. (2019). Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations . PROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019), 1260-1265.



cited authors

  • Soleimanikutanaei, Soheil; Lin, Cheng-Xian; Pala, Nezih; Quan, Gang; IEEE

publication date

  • January 1, 2019

webpage

author keyword

start page

  • 1260

end page

  • 1265