Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages Proceedings Paper

Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Agarwal, Amit et al. (2019). Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages . 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 718-725. 10.1109/ECTC.2019.00114



International Collaboration

cited authors

  • Dwarakanath, Shreya; Raj, Pulugurtha Markondeya; Agarwal, Amit; Okamoto, Daichi; Kubo, Atsushi; Liu, Fuhan; Kathaperumal, Mohan; Tummala, Rao R.; IEEE

fiu authors

publication date

  • January 1, 2019

webpage

author keyword

category

Digital Object Identifier (DOI)

start page

  • 718

end page

  • 725