Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages Proceedings Paper

International Collaboration

cited authors

  • Dwarakanath, Shreya; Raj, Pulugurtha Markondeya; Agarwal, Amit; Okamoto, Daichi; Kubo, Atsushi; Liu, Fuhan; Kathaperumal, Mohan; Tummala, Rao R.; IEEE

fiu authors

publication date

  • January 1, 2019

webpage

author keyword

category

Digital Object Identifier (DOI)

start page

  • 718

end page

  • 725