Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications Proceedings Paper

International Collaboration

cited authors

  • Watanabe, Atom O.; Wang, Yiteng; Ogura, Nobuo; Raj, P. Markondeya; Smet, Vanessa; Tentzeris, Manos M.; Tummala, Rao R.; IEEE

publication date

  • January 1, 2019

webpage

author keyword

category

Digital Object Identifier (DOI)

start page

  • 972

end page

  • 976