Reliability of Fine-Pitch <5-mu m-Diameter Microvias for High-Density Interconnects Article
Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi et al. (2020). Reliability of Fine-Pitch <5-mu m-Diameter Microvias for High-Density Interconnects
. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(9), 1552-1559. 10.1109/TCPMT.2020.3013197
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