Reliability of Fine-Pitch <5-mu m-Diameter Microvias for High-Density Interconnects Article

Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi et al. (2020). Reliability of Fine-Pitch <5-mu m-Diameter Microvias for High-Density Interconnects . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(9), 1552-1559. 10.1109/TCPMT.2020.3013197



International Collaboration

cited authors

  • Dwarakanath, Shreya; Kakutani, Takenori; Okamoto, Daichi; Raj, Pulugurtha Markondeya; Swaminathan, Madhavan; Tummala, Rao R.

fiu authors

publication date

  • September 1, 2020

webpage

published in

author keyword

category

Digital Object Identifier (DOI)

start page

  • 1552

end page

  • 1559

volume

  • 10

issue

  • 9