Reliability of Fine-Pitch <5-mu m-Diameter Microvias for High-Density Interconnects

Reliability of Fine-Pitch <5-mu m-Diameter Microvias for High-Density Interconnects Article

International Collaboration

cited authors

Dwarakanath, Shreya; Kakutani, Takenori; Okamoto, Daichi; Raj, Pulugurtha Markondeya; Swaminathan, Madhavan; Tummala, Rao R.

publication date

September 1, 2020

webpage

Web of Science

published in

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Journal

author keyword

Advanced packaging Author Keyword
Copper Author Keyword
Fan out Author Keyword
Fatigue Author Keyword
Geometry Author Keyword
Material properties Author Keyword
Polymers Author Keyword
RELIABILITY Author Keyword
Strain Author Keyword
heterogeneous integration Author Keyword
high-bandwidth computing Author Keyword
high-density Author Keyword
interconnects Author Keyword
interposer Author Keyword
microvia Author Keyword

category

MATERIALS SCIENCE, MULTIDISCIPLINARY Web of Science Category

Digital Object Identifier (DOI)

https://doi.org/10.1109/tcpmt.2020.3013197

start page

1552

end page

1559

volume

10

issue

9