High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer Proceedings Paper

cited authors

  • Monshi, Md Monirojjaman; Camara, Jose-Solis; Bhardwaj, Shubhendu; Volakis, John L.; Raj, P. M.; IEEE

publication date

  • January 1, 2020

webpage

author keyword

category

Digital Object Identifier (DOI)

start page

  • 835

end page

  • 840