A study on mechanical properties of eutectic and solid solution Pb-Sn-Ag solders from -200 degrees C to 150 degrees C Proceedings Paper

cited authors

  • Jones, WK; Liu, Y; Zampino, MA; Gonzalez, G; Shah, M; Mahidhara, RK; Frear, DR; Sastry, SML; Murty, KL; Liaw, PK; Winterbottom, WL

publication date

  • 1997


research area