Microstructure and mechanical properties of annealed Al-1%Si bonding wire Article

Liu, YQ, Jones, WK. (2004). Microstructure and mechanical properties of annealed Al-1%Si bonding wire . JOURNAL OF ELECTRONIC MATERIALS, 33(9), 10.1007/s11664-004-0018-9



cited authors

  • Liu, YQ; Jones, WK

publication date

  • September 2004

published in

author keyword

Digital Object Identifier (DOI)

volume

  • 33

issue

  • 9

research area