Microstructure and mechanical properties of annealed Al-1%Si bonding wire

Microstructure and mechanical properties of annealed Al-1%Si bonding wire Article

cited authors

Liu, YQ; Jones, WK

publication date

September 2004

webpage

Web of Science™

published in

JOURNAL OF ELECTRONIC MATERIALS Journal

author keyword

aluminum bonding wire Author Keyword
at-time elongation Author Keyword
fracture at zero elongation Author Keyword
recrystallization structure Author Keyword
ultra-long grain Author Keyword

category

ENGINEERING, ELECTRICAL & ELECTRONIC Web of Science Category
MATERIALS SCIENCE, MULTIDISCIPLINARY Web of Science Category
PHYSICS, APPLIED Web of Science Category

Digital Object Identifier (DOI)

https://doi.org/10.1007/s11664-004-0018-9

volume

33

issue

9

research area

Engineering Web of Science Research Area
Materials Science Web of Science Research Area
Physics Web of Science Research Area