Mechanical properties of Sn-In and Pb-In solders at low temperature Proceedings Paper

Jones, WK, Liu, YQ, Shah, M et al. (1997). Mechanical properties of Sn-In and Pb-In solders at low temperature . 3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 10.1109/ISAPM.1997.581258



cited authors

  • Jones, WK; Liu, YQ; Shah, M; INT MICROELECTR & PACKAGING SOC

publication date

  • 1997

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