Mechanical properties of Sn-In and Pb-In solders at low temperature

Mechanical properties of Sn-In and Pb-In solders at low temperature Proceedings Paper

cited authors

Jones, WK; Liu, YQ; Shah, M; INT MICROELECTR & PACKAGING SOC

publication date

1997

webpage

Web of Science™

published in

3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS Book

category

ENGINEERING, ELECTRICAL & ELECTRONIC Web of Science Category
MATERIALS SCIENCE, MULTIDISCIPLINARY Web of Science Category

Digital Object Identifier (DOI)

https://doi.org/10.1109/isapm.1997.581258

research area

Engineering Web of Science Research Area
Materials Science Web of Science Research Area