Investigation of the temperature character of IGBT wire bonding lift-off based the 3-D thermal-electro coupling FEM Conference

Zheng, L, Han, L, Jin, P et al. (2013). Investigation of the temperature character of IGBT wire bonding lift-off based the 3-D thermal-electro coupling FEM . 616-618 1689-1692. 10.4028/www.scientific.net/AMR.616-618.1689

cited authors

  • Zheng, L; Han, L; Jin, P; Fang, H; Wang, C; Wang, Z

fiu authors

abstract

  • Al wire bonding lift-off is one of the main failure modes of IGBT module. When the severity of the failure mode is different, the temperature character of IGBT is also different. This paper presents a methodology based on 3D electro-thermal coupling finite elements modeling intended to analyze the relation between the failure degree and the temperature, and compares the influence degree of Al wire bonding lift-off to the performance of IGBT module. This method and the corresponding results help to evaluate Al wire bonding lift-off how they influence the performance of IGBT, determine the failure, establish the failure standards and find the optimization of structure design. © (2013) Trans Tech Publications, Switzerland.

publication date

  • January 8, 2013

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

  • 9783037855522

start page

  • 1689

end page

  • 1692

volume

  • 616-618