Wafer-level mechanical characterization of silicon nitride MEMS Article

Kaushik, A, Kahn, H, Heuer, AH. (2005). Wafer-level mechanical characterization of silicon nitride MEMS . 14(2), 359-367. 10.1109/JMEMS.2004.839315



keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • FAILURE
  • Instruments & Instrumentation
  • Nanoscience & Nanotechnology
  • POLYSILICON
  • Physical Sciences
  • Physics
  • Physics, Applied
  • STRESS
  • Science & Technology
  • Science & Technology - Other Topics
  • TENSILE
  • THERMAL-EXPANSION
  • THIN-FILMS
  • Technology
  • bulge
  • modulus
  • silicon nitride
  • strength

Digital Object Identifier (DOI)

start page

  • 359

end page

  • 367

volume

  • 14

issue

  • 2