Thermal and mechanical design of tangential hybrid microchannel and high-conductivity inserts for cooling of disk-shaped electronic components Article

keywords

  • Chemistry
  • Chemistry, Analytical
  • Chemistry, Physical
  • Cooling
  • High-conductivity
  • Hybrid method
  • Microchannel
  • NANOFLUID FLOW
  • Strength
  • Thermal stresses
  • Thermodynamics
  • VASCULARIZATION

Digital Object Identifier (DOI)

start page

  • 2125

end page

  • 2133

volume

  • 143

issue

  • 3