Study on Cu nanowires by using in-situ high-temperature XRD Article

Cai, Q, Zhang, J, Chen, X et al. (2007). Study on Cu nanowires by using in-situ high-temperature XRD . 30(7), 565-567.



cited authors

  • Cai, Q; Zhang, J; Chen, X; Chen, Z; Wang, W; Mo, G; Zhang, K; Hu, T; Wu, Z; Zhang, L

fiu authors

abstract

  • Cu nanowires with diameter of about 50 nm were electrochemically deposited in anodic alumina membrane. An in-situ high-temperature XRD technique was used to measure the crystalline structures. The results demonstrate that these Cu nanowires have a thermal expansion coefficient of about 2.6 × 10-5 K-1, which is a little larger than the bulk's one. These polycrystalline Cu nanowires are completely different from the zero-expansion Cu nanowires reported in previous reference. It is concluded that the thermal expansion coefficient is dependent on the crystalline perfection in nanowires.

publication date

  • July 1, 2007

start page

  • 565

end page

  • 567

volume

  • 30

issue

  • 7