Design of the temperature field test system of power electronic packaging modules Conference

Hua, J, Jin, PY, Zheng, LB et al. (2014). Design of the temperature field test system of power electronic packaging modules . 875-877 1929-1933. 10.4028/www.scientific.net/AMR.875-877.1929

cited authors

  • Hua, J; Jin, PY; Zheng, LB; Fang, HC; Wang, CL; Han, L; Song, P

fiu authors

abstract

  • The defects of material, packaging process and layout in power electronic packaging modules can affect the temperature distribution. Defects such as the voids of the welding and the unreasonable layout will cause uneven distribution of the temperature field in the internal surface and the local hot spots will emerge. If the hot spots continued, the module will be damaged. In order to achieve the defect analysis based on the temperature field, a test system is designed. The infrared camera is used to measure the temperature distribution in the system. The system can test the temperature field distribution characteristics with different loads. The study provided a strong basis of defect analysis standards based on temperature field. © (2014) Trans Tech Publications, Switzerland.

publication date

  • January 1, 2014

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

  • 9783037859933

start page

  • 1929

end page

  • 1933

volume

  • 875-877