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2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
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Overview
publication venue for
3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas
2019
Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages
2019
Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications
2019
Identifiers
International Standard Serial Number (ISSN)
0569-5503
Electronic International Standard Serial Number (EISSN)
2377-5726
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journal abbreviation
ELEC COMP C