2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) Book

publication venue for

3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas 2019
Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages 2019
Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications 2019

International Standard Serial Number (ISSN)

0569-5503

Electronic International Standard Serial Number (EISSN)

2377-5726

journal abbreviation

ELEC COMP C